Prime Minister Narendra Modi on September 17, 2026, virtually inaugurated commercial production at Suchi Semicon’s Semiconductor Assembly and Testing (OSAT) plant at Palsana in Surat during the ‘Semicon India 2026’ event in New Delhi.
The semiconductor project was approved by the Union Cabinet in May 2026 under the India Semiconductor Mission. Established with an investment of approximately ₹868 crore, the unit has an annual production capacity of 1,033.20 million (103.32 crore) semiconductor chips.
The facility undertakes semiconductor chip assembly, advanced packaging and testing, with capabilities including SOIC, QFN and advanced IC packaging. The chips will primarily serve sectors such as power electronics, analogue integrated circuits, automotive and electric vehicles, industrial automation, consumer electronics, and energy and power management devices.
Technology partnership with Japan’s ROHM Semiconductor
High-quality cleanrooms are operational at the facility, which has also dispatched its first consumer shipment from India. Suchi Semicon has entered into a technology collaboration with Japanese company ROHM Semiconductor to adopt advanced technologies and global quality standards.
Suchi Semicon’s Palsana plant is expected to further strengthen Gujarat’s growing semiconductor ecosystem. With the Tata-PSMC semiconductor fab at Dholera and projects by Micron, CG Semi and Kaynes Semicon in Sanand, the state is emerging as a key centre for the semiconductor sector.
Suchi Semicon has expressed gratitude to the Central and state governments for their support in achieving the milestone. The company has also committed to building a robust semiconductor packaging and testing ecosystem in Gujarat by leveraging advanced technology, skilled talent, local supply chains and collaborations with educational institutions, the press release said
